Recently added

Challenges for future system architectures (power, variability)

Catthoor, Francky (2007)

Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines

Carbonell, Laure; Volders, Henny; Haider, A.; Heylen, Nancy; Richard, Olivier; Palmans, Roger; Travaly, Youssef; Tokei, Zsolt; Boelen, Pieter; Rosenfeld, A.; Mandrekar, T.; Hernandez, Jose Luis; Vanhaelemeersch, Serge (2007)

Enhancement of the relaxation of SiGe layers by He ion implantation using a delta-Si:C layer

Buca, D.; Goryll, M.; Hollaender, B.; Trinkaus, H.; Mantl, S.; Loo, Roger; Nguyen, Duy (2007)

Europe brings nanotechnology to SMEs

Bruynseraede, Christophe (2007)

Near-optimal 3D context modeling for JPEG2000 Part 10

Bruylants, Tim; Alecu, A.; Jansen, B.; Deklerck, R.; Munteanu, A.; Schelkens, Peter (2007)

Plasmonics – the missing link between nanoelectronics and microphotonics

Brongersma, Mark; Barnard, Edward; Chandran, Anu; Van Dorpe, Pol; Chul, Young; Liu, J.; Pala, R.; Schuller, J.A.; White, Justin; Taubner, Tomas; Zia, Rashid (2007)

PHY Layer Submission for 802.15.3c

Bourdoux, André; De Rore, Stefaan; Nsenga, Jimmy; Van Thillo, Wim (2007)

60 GHz system-level issues and the influence of front-end non-idealities on the link performance

Bourdoux, André (2007)

Nanotechnology towards biomedical applications

Bonroy, Kristien; Lureyn, Wim; Reekmans, Gunter; De Palma, Randy; Jans, Karolien; Van de Broek, Bieke; Jans, Hilde; Peeters, Sara; Stakenborg, Tim; Ye, Jian; Thimiri Govinda Rai, Deepak B. (2007)

A platform for silicon-on-insulator nanophotonics on industrial CMOS tools

Bogaerts, Wim; Dumon, Pieter; Fedeli, J.M.; Tchelnokov, A.; Van Thourhout, Dries; Selvaraja, Shankar; Baets, Roel (2007)

Backside illuminated active pixel sensors for earth observation

Bogaerts, Jan; De Moor, Piet; De Munck, Koen; Sabuncuoglu Tezcan, Deniz (2007)

Medical electronic system miniaturization using ultra thin chip embedding and stacking technology

Beyne, Eric; Vanden Bulcke, Mathieu; Iker, Francois; Baert, Kris; Van Hoof, Chris (2007)

Heterogeneous integration of passive components for the realization of RF-System-in-Packages

Beyne, Eric; De Raedt, Walter; Carchon, Geert; Soussan, Philippe (2007)

Technologies for Hard and software reconfigurable radios

Beyne, Eric; De Raedt, Walter; Carchon, Geert; Soussan, Philippe (2007)

Cost effective 3D-system integration using through-silicon-via technologies

Beyne, Eric (2007)

Design, process and material requirements for successful heterogeneous passive component integration in rf-systems

Beyne, Eric (2007)

Cost-effective 3D-system integration using through silicon via technologies

Beyne, Eric (2007)

Strategy for cost-effective 3D-system integration

Beyne, Eric (2007)

Introduction to semiconductor packaging technology

Beyne, Eric (2007)

Die requirements for 3D integration

Beyne, Eric (2007)

Presentations: Recent submissions

Challenges for future system architectures (power, variability) ﻿

Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines ﻿

Enhancement of the relaxation of SiGe layers by He ion implantation using a delta-Si:C layer ﻿

Europe brings nanotechnology to SMEs ﻿

Near-optimal 3D context modeling for JPEG2000 Part 10 ﻿

Plasmonics – the missing link between nanoelectronics and microphotonics ﻿

PHY Layer Submission for 802.15.3c ﻿

60 GHz system-level issues and the influence of front-end non-idealities on the link performance ﻿

Nanotechnology towards biomedical applications ﻿

A platform for silicon-on-insulator nanophotonics on industrial CMOS tools ﻿

Backside illuminated active pixel sensors for earth observation ﻿

Medical electronic system miniaturization using ultra thin chip embedding and stacking technology ﻿

Heterogeneous integration of passive components for the realization of RF-System-in-Packages ﻿

Technologies for Hard and software reconfigurable radios ﻿

Cost effective 3D-system integration using through-silicon-via technologies ﻿

Design, process and material requirements for successful heterogeneous passive component integration in rf-systems ﻿

Cost-effective 3D-system integration using through silicon via technologies ﻿

Strategy for cost-effective 3D-system integration ﻿

Introduction to semiconductor packaging technology ﻿

Die requirements for 3D integration ﻿

Challenges for future system architectures (power, variability)

Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines

Enhancement of the relaxation of SiGe layers by He ion implantation using a delta-Si:C layer

Europe brings nanotechnology to SMEs

Near-optimal 3D context modeling for JPEG2000 Part 10

Plasmonics – the missing link between nanoelectronics and microphotonics

PHY Layer Submission for 802.15.3c

60 GHz system-level issues and the influence of front-end non-idealities on the link performance

Nanotechnology towards biomedical applications

A platform for silicon-on-insulator nanophotonics on industrial CMOS tools

Backside illuminated active pixel sensors for earth observation

Medical electronic system miniaturization using ultra thin chip embedding and stacking technology

Heterogeneous integration of passive components for the realization of RF-System-in-Packages

Technologies for Hard and software reconfigurable radios

Cost effective 3D-system integration using through-silicon-via technologies

Design, process and material requirements for successful heterogeneous passive component integration in rf-systems

Cost-effective 3D-system integration using through silicon via technologies

Strategy for cost-effective 3D-system integration

Introduction to semiconductor packaging technology

Die requirements for 3D integration