Recently added

Process technology and packaging in sensor nodes

Beyne, Eric (2007)

How to develop System-in-Package (SIP) solutions

Beyne, Eric (2007)

3D packaging - challenges

Beyne, Eric (2007)

Introduction to semiconductor packaging technology

Beyne, Eric (2007)

Preparation of porous nanocrystalline oxide layers by deposition of hydrothermally synthesized nanoparticles for use in photovoltaic devices

Beusen, J.; Moons, Wouter; Van Bael, Marlies; Van den Rul, Heidi; D'Haen, Jan; Manca, Jean; Mullens, J. (2007)

Dual beam FIB/SEM cross-section imaging of nano-structures

Bender, Hugo; Drijbooms, Chris; Van Marcke, Patricia; Geypen, Jef; Marrant, Koen (2007)

Towards the understanding of CH3F/O2 chemistry

Altamirano Sanchez, Efrain; Kunnen, Eddy; Boullart, Werner (2007)

Influence of vacuum environment in conductive AFM measurements on advanced MOS gate dielectrics

Aguilera, Lidia; Polspoel, Wouter; Vandervorst, Wilfried; Nafria, Montserrat; Aymerich, Xavier (2007)

Processing technologies for organic photovoltaics at IMEC

Aernouts, Tom (2007)

Processing technologies for organic solar cells

Aernouts, Tom (2007)

Macromolecule adsorption at liquid-solid interface: A combined SPR and QCM-D Study

Zhou, Cheng; Friedt, Jean-Michel; Francis, Laurent; Reekmans, Gunter; Engelborghs, Yves; Borghs, Gustaaf (2005)

Constructing high-performance biosensor interface through solvent controlled self-assembly of PEG grafted polymer

Zhou, Cheng; De Keersmaecker, Koen; Braeken, Dries; Reekmans, Gunter; Bartic, Carmen; De Smedt, Humbert; Engelborghs, Yves; Borghs, Gustaaf (2005)

Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect

Zhang, Wenqi; Brongersma, Sywert; Van Aelst, Joke; Richard, Olivier; Bamal, Mandeep; Heylen, Nancy; Li, Yunlong; Beyer, Gerald; Maex, Karen (2005)

STM investigation of Mn delta-doped GaAs

Yakunin, A.M.; Silov, A.Yu.; Koenraad, P.M.; Wolter, J.H.; Van Roy, Wim; De Boeck, Jo; Kolovos, D.; Däweritz, L.; Ploog, K.H.; Tang, J.M. Tang; Flatté, M.E. (2005)

Overview of FeRAM, MRAM and PCM memory technology development status and critical comparison for unified memory application

Wouters, Dirk (2005)

Presentations: Recent submissions

Process technology and packaging in sensor nodes

How to develop System-in-Package (SIP) solutions

3D packaging - challenges

Introduction to semiconductor packaging technology

Preparation of porous nanocrystalline oxide layers by deposition of hydrothermally synthesized nanoparticles for use in photovoltaic devices

Dual beam FIB/SEM cross-section imaging of nano-structures

Towards the understanding of CH3F/O2 chemistry

Influence of vacuum environment in conductive AFM measurements on advanced MOS gate dielectrics

Processing technologies for organic photovoltaics at IMEC

Processing technologies for organic solar cells

Macromolecule adsorption at liquid-solid interface: A combined SPR and QCM-D Study

Constructing high-performance biosensor interface through solvent controlled self-assembly of PEG grafted polymer

Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect

STM investigation of Mn delta-doped GaAs

Overview of FeRAM, MRAM and PCM memory technology development status and critical comparison for unified memory application

Integration and scaling challenges of 3D SBT FeCAP's

Scaling of ferroelectric memory below the 100nm node: possible routes and challenges

A computational approach to predict the motion of magnetic particles manipulated by on-chip generated magnetic forces

Boron doped nanocrystalline diamond films

DNA attachment to NCD films for future biosensing applications

Presentations: Recent submissions

Process technology and packaging in sensor nodes ﻿

How to develop System-in-Package (SIP) solutions ﻿

3D packaging - challenges ﻿

Introduction to semiconductor packaging technology ﻿

Preparation of porous nanocrystalline oxide layers by deposition of hydrothermally synthesized nanoparticles for use in photovoltaic devices ﻿

Dual beam FIB/SEM cross-section imaging of nano-structures ﻿

Towards the understanding of CH3F/O2 chemistry ﻿

Influence of vacuum environment in conductive AFM measurements on advanced MOS gate dielectrics ﻿

Processing technologies for organic photovoltaics at IMEC ﻿

Processing technologies for organic solar cells ﻿

Macromolecule adsorption at liquid-solid interface: A combined SPR and QCM-D Study ﻿

Constructing high-performance biosensor interface through solvent controlled self-assembly of PEG grafted polymer ﻿

Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect ﻿

STM investigation of Mn delta-doped GaAs ﻿

Overview of FeRAM, MRAM and PCM memory technology development status and critical comparison for unified memory application ﻿

Integration and scaling challenges of 3D SBT FeCAP's ﻿

Scaling of ferroelectric memory below the 100nm node: possible routes and challenges ﻿

A computational approach to predict the motion of magnetic particles manipulated by on-chip generated magnetic forces ﻿

Boron doped nanocrystalline diamond films ﻿

DNA attachment to NCD films for future biosensing applications ﻿

Process technology and packaging in sensor nodes

How to develop System-in-Package (SIP) solutions

3D packaging - challenges

Introduction to semiconductor packaging technology

Preparation of porous nanocrystalline oxide layers by deposition of hydrothermally synthesized nanoparticles for use in photovoltaic devices

Dual beam FIB/SEM cross-section imaging of nano-structures

Towards the understanding of CH3F/O2 chemistry

Influence of vacuum environment in conductive AFM measurements on advanced MOS gate dielectrics

Processing technologies for organic photovoltaics at IMEC

Processing technologies for organic solar cells

Macromolecule adsorption at liquid-solid interface: A combined SPR and QCM-D Study

Constructing high-performance biosensor interface through solvent controlled self-assembly of PEG grafted polymer

Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect

STM investigation of Mn delta-doped GaAs

Overview of FeRAM, MRAM and PCM memory technology development status and critical comparison for unified memory application

Integration and scaling challenges of 3D SBT FeCAP's

Scaling of ferroelectric memory below the 100nm node: possible routes and challenges

A computational approach to predict the motion of magnetic particles manipulated by on-chip generated magnetic forces

Boron doped nanocrystalline diamond films

DNA attachment to NCD films for future biosensing applications