Recently added

Preambles for MIMO channel estimation

Bourdoux, André; Van Poucke, Bart; Van der Perre, Liesbet (2004)

Electrical spin injection into a semiconductor

Borghs, Gustaaf; Van Dorpe, Pol; Van Roy, Wim (2004)

Oriented immobilization of different antibody fragments to increase biosensor responses

Bonroy, Kristien; Reekmans, Gunter; Frederix, Filip; De Palma, Randy; Laureyn, Wim; Van Hoof, Chris; Goddeeris, Bruno; Borghs, Gustaaf; Declerck, Paul (2004)

Integration of a composite SiO2HfO2 interpoly dielectric layer for low voltage polypoly erase in a 0.18μm HIMOSTM memory cell.

Blomme, Pieter; Haspeslagh, Luc; De Vos, Joeri; Lorenzini, Martino; Van Houdt, Jan; De Meyer, Kristin (2004)

Challenges in FEOL for 45nm and beyond

Biesemans, Serge (2004)

RF systems in a package

Beyne, Eric; De Raedt, Walter; Carchon, Geert; Brebels, Steven; Tilmans, Harrie (2004)

Interconnect and packaging technologies for realizing miniaturized smart devices

Beyne, Eric (2004)

Multilayer thin film, enabling technology for WLP and SIP

Beyne, Eric (2004)

Challenges for the interconnect industry - outsourcing and the interconnect bottleneck

Beyne, Eric (2004)

High density multilayer thin film interconnect technologies for SiP

Beyne, Eric (2004)

Wafer level packaging technologies

Beyne, Eric (2004)

Ultradense packaging aspects. 3D interconnection and packaging: impending reality or still a dream?

Beyne, Eric (2004)

Multilayer thin film technology for systems packaging

Beyne, Eric (2004)

Some observations on the corrosion of Cu after FIB preparation

Bender, Hugo; Richard, Olivier; Benedetti, Alessandro; Van Marcke, Patricia; Drijbooms, Chris (2004)

FIB studies of advanced devices

Bender, Hugo (2004)

Exciton formation and dissociation in conjugated polymers: a quantumchemical view

Beljonne, D.; Brédas, J.-L.; Ye, A.; Bässler, H.; Kadashchuk, A.; Arkhipov, Vladimir; Shuai, Z. (2004)

Implementation of high-K and metal gate materials for the 45nm node and beyond: gate patterning development

Beckx, Stephan; Demand, Marc; Locorotondo, Sabrina; Henson, K.; Claes, Martine; Paraschiv, Vasile; Shamiryan, Denis; Jaenen, Patrick; Boullart, Werner; De Gendt, Stefan; Biesemans, Serge; Vanhaelemeersch, Serge; Vertommen, Johan; Coenegrachts, Bart (2004)

Presentations: Recent submissions

Preambles for MIMO channel estimation

Electrical spin injection into a semiconductor

Converging nano-technologies

Nanotechnology at IMEC

Oriented immobilization of different antibody fragments to increase biosensor responses

Integration of a composite SiO2HfO2 interpoly dielectric layer for low voltage polypoly erase in a 0.18μm HIMOSTM memory cell.

Challenges in FEOL for 45nm and beyond

RF systems in a package

Interconnect and packaging technologies for realizing miniaturized smart devices

Wafer level packaging

Multilayer thin film, enabling technology for WLP and SIP

Challenges for the interconnect industry - outsourcing and the interconnect bottleneck

High density multilayer thin film interconnect technologies for SiP

Wafer level packaging technologies

Ultradense packaging aspects. 3D interconnection and packaging: impending reality or still a dream?

Multilayer thin film technology for systems packaging

Some observations on the corrosion of Cu after FIB preparation

FIB studies of advanced devices

Exciton formation and dissociation in conjugated polymers: a quantumchemical view

Implementation of high-K and metal gate materials for the 45nm node and beyond: gate patterning development

Presentations: Recent submissions

Preambles for MIMO channel estimation ﻿

Electrical spin injection into a semiconductor ﻿

Converging nano-technologies ﻿

Nanotechnology at IMEC ﻿

Oriented immobilization of different antibody fragments to increase biosensor responses ﻿

Integration of a composite SiO2HfO2 interpoly dielectric layer for low voltage polypoly erase in a 0.18μm HIMOSTM memory cell. ﻿

Challenges in FEOL for 45nm and beyond ﻿

RF systems in a package ﻿

Interconnect and packaging technologies for realizing miniaturized smart devices ﻿

Wafer level packaging ﻿

Multilayer thin film, enabling technology for WLP and SIP ﻿

Challenges for the interconnect industry - outsourcing and the interconnect bottleneck ﻿

High density multilayer thin film interconnect technologies for SiP ﻿

Wafer level packaging technologies ﻿

Ultradense packaging aspects. 3D interconnection and packaging: impending reality or still a dream? ﻿

Multilayer thin film technology for systems packaging ﻿

Some observations on the corrosion of Cu after FIB preparation ﻿

FIB studies of advanced devices ﻿

Exciton formation and dissociation in conjugated polymers: a quantumchemical view ﻿

Implementation of high-K and metal gate materials for the 45nm node and beyond: gate patterning development ﻿

Preambles for MIMO channel estimation

Electrical spin injection into a semiconductor

Converging nano-technologies

Nanotechnology at IMEC

Oriented immobilization of different antibody fragments to increase biosensor responses

Integration of a composite SiO2HfO2 interpoly dielectric layer for low voltage polypoly erase in a 0.18μm HIMOSTM memory cell.

Challenges in FEOL for 45nm and beyond

RF systems in a package

Interconnect and packaging technologies for realizing miniaturized smart devices

Wafer level packaging

Multilayer thin film, enabling technology for WLP and SIP

Challenges for the interconnect industry - outsourcing and the interconnect bottleneck

High density multilayer thin film interconnect technologies for SiP

Wafer level packaging technologies

Ultradense packaging aspects. 3D interconnection and packaging: impending reality or still a dream?

Multilayer thin film technology for systems packaging

Some observations on the corrosion of Cu after FIB preparation

FIB studies of advanced devices

Exciton formation and dissociation in conjugated polymers: a quantumchemical view

Implementation of high-K and metal gate materials for the 45nm node and beyond: gate patterning development