Recently added

Metal contamination on silicon surfaces from solvents

Bearda, Twan; Vandermot, Ief; Van den Broeck, Kristel; Van Hoornick, Nausikaa; Van Hoeymissen, Jan; Mertens, Paul (2004)

The impact of backside particles on the limits of optical lithography

Bearda, Twan; Mertens, Paul; Holsteyns, Frank; De Bisschop, Peter; Compen, R.; van Meer, R.; Heyns, Marc (2004)

Porous low dielectric constant materials for microelectronics

Baklanov, Mikhaïl (2004)

Porous low dielectric constant materials for microelectronics

Baklanov, Mikhaïl (2004)

In-situ ellipsometry for BEOL research and development

Baklanov, Mikhaïl (2004)

Nanophotonic integrated circuits

Baets, Roel (2004)

World of MEMS

Baert, Kris (2004)

A 0.6 V 1.6 mW fully integrated voltage controlled oscillator in 90 nm CMOS aiming for the GPS L1 band

Aspemyr, Lars; Linten, Dimitri (2004)

Pitfalls in heavy ion ERD measurements

Arstila, Kai; Sajavaara, Timo; Brijs, Bert (2004)

Composite nanoparticles for defectivity reduction during CMP

Armini, Silvia; Terzieva, Valentina; Vanhaelemeersch, Serge; Maex, Karen (2004)

Application of negative charge dielectrics for solar cells

Agostinelli, Guido; Vitanov, Petko; Harizanova, A.; Ivanova, T.; Alexieva, Z.; Vukadinovic, Miso; Q. Lee, Nam (2004)

Band alignment between (100)Si and complex rare-earth/transition metal oxides

Afanasiev, Valeri; Stesmans, Andre; Zhao, Chao; Caymax, Matty; Heeg,; Schubert,; Jia, Y.; Schlom, D.; Lucovsky, G. (2004)

Functional polsiloxane-G-poly(ethylene Glycol) layers on gold surface: surface characterization and resistance to protein adsorption

Zhou, Cheng; Khlestkin, V.K.; Laureyn, Wim; Reekmans, Gunter; Campitelli, Andrew; Borghs, Gustaaf; Dehaen, W. (2003)

Presentations: Recent submissions

Metal contamination on silicon surfaces from solvents

The impact of backside particles on the limits of optical lithography

Porous low dielectric constant materials for microelectronics

Porous low dielectric constant materials for microelectronics

In-situ ellipsometry for BEOL research and development

Nanophotonic integrated circuits

World of MEMS

A 0.6 V 1.6 mW fully integrated voltage controlled oscillator in 90 nm CMOS aiming for the GPS L1 band

Pitfalls in heavy ion ERD measurements

Composite nanoparticles for defectivity reduction during CMP

Application of negative charge dielectrics for solar cells

Band alignment between (100)Si and complex rare-earth/transition metal oxides

Functional polsiloxane-G-poly(ethylene Glycol) layers on gold surface: surface characterization and resistance to protein adsorption

QCM-D, SPR and AFM study of the adsorption of IgG on hydrophobic surfaces

The thickness and temperature dependent resistivity of thin copper films

Which defect breaks down gate oxides?

Different types of positive charges generated near the oxide/Si interface

STM imaging and tunneling spectroscopy on the (Mn2+3d5 + hole) complex in GaAs

Electrical and microstructural characterization of narrow Cu interconnects

Poly-SiGe, a superb material for MEMS

Presentations: Recent submissions

Metal contamination on silicon surfaces from solvents ﻿

The impact of backside particles on the limits of optical lithography ﻿

Porous low dielectric constant materials for microelectronics ﻿

Porous low dielectric constant materials for microelectronics ﻿

In-situ ellipsometry for BEOL research and development ﻿

Nanophotonic integrated circuits ﻿

World of MEMS ﻿

A 0.6 V 1.6 mW fully integrated voltage controlled oscillator in 90 nm CMOS aiming for the GPS L1 band ﻿

Pitfalls in heavy ion ERD measurements ﻿

Composite nanoparticles for defectivity reduction during CMP ﻿

Application of negative charge dielectrics for solar cells ﻿

Band alignment between (100)Si and complex rare-earth/transition metal oxides ﻿

Functional polsiloxane-G-poly(ethylene Glycol) layers on gold surface: surface characterization and resistance to protein adsorption ﻿

QCM-D, SPR and AFM study of the adsorption of IgG on hydrophobic surfaces ﻿

The thickness and temperature dependent resistivity of thin copper films ﻿

Which defect breaks down gate oxides? ﻿

Different types of positive charges generated near the oxide/Si interface ﻿

STM imaging and tunneling spectroscopy on the (Mn2+3d5 + hole) complex in GaAs ﻿

Electrical and microstructural characterization of narrow Cu interconnects ﻿

Poly-SiGe, a superb material for MEMS ﻿

Metal contamination on silicon surfaces from solvents

The impact of backside particles on the limits of optical lithography

Porous low dielectric constant materials for microelectronics

Porous low dielectric constant materials for microelectronics

In-situ ellipsometry for BEOL research and development

Nanophotonic integrated circuits

World of MEMS

A 0.6 V 1.6 mW fully integrated voltage controlled oscillator in 90 nm CMOS aiming for the GPS L1 band

Pitfalls in heavy ion ERD measurements

Composite nanoparticles for defectivity reduction during CMP

Application of negative charge dielectrics for solar cells

Band alignment between (100)Si and complex rare-earth/transition metal oxides

Functional polsiloxane-G-poly(ethylene Glycol) layers on gold surface: surface characterization and resistance to protein adsorption

QCM-D, SPR and AFM study of the adsorption of IgG on hydrophobic surfaces

The thickness and temperature dependent resistivity of thin copper films

Which defect breaks down gate oxides?

Different types of positive charges generated near the oxide/Si interface

STM imaging and tunneling spectroscopy on the (Mn2+3d5 + hole) complex in GaAs

Electrical and microstructural characterization of narrow Cu interconnects

Poly-SiGe, a superb material for MEMS