Recently added

Jonckheere, Rik; Hermans, Jan; Goethals, Mieke; De Bisschop, Peter; Eliat, Astrid; Van Den Heuvel, Dieter; Van Roey, Frieda; Beckx, Stephan; Wouters, Johan M. D.; de Marneffe, Jean-Francois; Ronse, Kurt (2003)

Integration of ferroelectric SrBi2Ta2O9-based capacitors beyond 0.18 CMOS technology

Johnson, J.; Goux, Ludovic; Schwitters, Michael; Paraschiv, Vasile; Maes, David; Haspeslagh, Luc; Wouters, Dirk; Caputa, Concetta; Casella, C.; Zambrano, R.; Vecchio, Emma; Monchoix, Hervé; Van Autryve, Luc; Lisoni, Judit (2003)

High-density hybrid interconnect methodologies

John, Joachim; Zimmermann, Lars; De Moor, Piet; Van Hoof, Chris (2003)

RF CMOS front end optimization

Jeamsaksiri, Wutthinan; Jurczak, Gosia; Rooyackers, Rita; Linten, Dimitri; Ramos, Javier (2003)

RF CMOS front end optimization

Jeamsaksiri, Wutthinan; Jurczak, Gosia; Rooyackers, Rita; Linten, Dimitri; Ramos, Javier (2003)

Tof-SIMS depth profiling of Hf and Al composition variations in ultrathin mixed HfO2/Al2O3 oxides

Houssiau, L.; Vitchev, R.G.; Conard, Thierry; Vandervorst, Wilfried; Bender, Hugo (2003)

Epitaxial erbium silicide contact to silicon-germanium

Horvath, Z.; Molnart, G.; Peto, G.; Deszi, I.; Loo, Roger; Caymax, Matty; Z'd'ansky, K. (2003)

Aqueous CSD of ferroelectric (Bi,La)4Ti3O12 (BLT) thin films

Hardy, An; Nelis, Daniël; Vanhoyland, G.; Van Bael, Marlies; Mullens, J.; Van Poucke, L.; D'Haen, Jan; Wouters, Dirk (2003)

Possibilities for sensors for the man of the future

Gyselinckx, Bert (2003)

Possibilities for sensors for the man of the future

Gyselinckx, Bert (2003)

Influence d'une passivation précédée d'un traitement de surface sur le comportement électrique en regime statique d'un HEMT AlGaN/GaN

Guhel, Y.; Boudart, B.; Vellas, N.; Gaquiere, C.; Delos, E.; Ducateau, D.; Bougrioua, Z.; Germain, Marianne; de Jaeger, J.C. (2003)

Successes and challenges for the electrical performance of high-k gate dielectrics in future CMOS applications

Groeseneken, Guido (2003)

Presentations: Recent submissions

Increased Gilbert damping in spin-valve and magnetic tunnel junction devices ﻿

Visual content processing and representation - 3D graphics: present and future? ﻿

Impact of intermetallic formation and electro-migration on the integrity of bumped Cu/low-k Die ﻿

Etching of HfO2, deposited on LPCVD Si3N4, and cleaning of Hf residues ﻿

Strained silicon SiGe HFETs for microwave applications ﻿

Superconducting ring-transformers as basis of a quantum computer ﻿

Superconducting ring-transformers as basis of a quantum computer ﻿

Reticle terminology and metrology needs for advanced 193nm and 157nm lithography ﻿

Status of 157nm Lithography Development ﻿

Integration of ferroelectric SrBi2Ta2O9-based capacitors beyond 0.18 CMOS technology ﻿

High-density hybrid interconnect methodologies ﻿

RF CMOS front end optimization ﻿

RF CMOS front end optimization ﻿

Tof-SIMS depth profiling of Hf and Al composition variations in ultrathin mixed HfO2/Al2O3 oxides ﻿

Epitaxial erbium silicide contact to silicon-germanium ﻿

Aqueous CSD of ferroelectric (Bi,La)4Ti3O12 (BLT) thin films ﻿

Possibilities for sensors for the man of the future ﻿

Possibilities for sensors for the man of the future ﻿

Influence d'une passivation précédée d'un traitement de surface sur le comportement électrique en regime statique d'un HEMT AlGaN/GaN ﻿

Successes and challenges for the electrical performance of high-k gate dielectrics in future CMOS applications ﻿

Increased Gilbert damping in spin-valve and magnetic tunnel junction devices

Visual content processing and representation - 3D graphics: present and future?

Impact of intermetallic formation and electro-migration on the integrity of bumped Cu/low-k Die

Etching of HfO2, deposited on LPCVD Si3N4, and cleaning of Hf residues

Strained silicon SiGe HFETs for microwave applications

Superconducting ring-transformers as basis of a quantum computer

Superconducting ring-transformers as basis of a quantum computer

Reticle terminology and metrology needs for advanced 193nm and 157nm lithography

Status of 157nm Lithography Development

Integration of ferroelectric SrBi2Ta2O9-based capacitors beyond 0.18 CMOS technology

High-density hybrid interconnect methodologies

RF CMOS front end optimization

RF CMOS front end optimization

Tof-SIMS depth profiling of Hf and Al composition variations in ultrathin mixed HfO2/Al2O3 oxides

Epitaxial erbium silicide contact to silicon-germanium

Aqueous CSD of ferroelectric (Bi,La)4Ti3O12 (BLT) thin films

Possibilities for sensors for the man of the future

Possibilities for sensors for the man of the future

Influence d'une passivation précédée d'un traitement de surface sur le comportement électrique en regime statique d'un HEMT AlGaN/GaN

Successes and challenges for the electrical performance of high-k gate dielectrics in future CMOS applications