Recently added

Report of AHG on video decoder quality of service

Lafruit, Gauthier (1999)

Implementation October 1999 meeting report - chairman report

Lafruit, Gauthier (1999)

Induced magnetoresistance in semiconducting devices due to single sub-micron magnetic barriers and random magnetic fields

Kubrak, V.; Rushforth, A. W.; Rahman, F.; Gallagher, B. L.; Main, P. C.; De Bock, J.; Behet, Markus; Marrows, C. H.; Howson, M. A. (1999)

A self-calibrating logarithmic image sensor

Kavadias, Spyros; Dierickx, Bart; Meynants, Guy (1999)

Chemical role of SF6 in a SiCl4-based reactive ion etching of GaN

Karouta, F.; Jacobs, B.; Kramer, M. C. J. C. M.; Jacobs, Koen; Moerman, Ingrid (1999)

Ideal chemistry for reactive ion etching of GaN

Karouta, F.; Jacobs, B.; Jacobs, Koen; Moerman, Ingrid (1999)

Ideal chemistry for reactive ion etching of GaN

Karouta, F.; Jacobs, B.; Jacobs, Koen; Moerman, Ingrid (1999)

Investigation of properties of SiO2 defects created during electric stressing at different temperatures

Kaczer, Ben; Degraeve, Robin; Pangon, Nadège; Groeseneken, Guido (1999)

Host guest system in small molecule-doped polymer light-emitting diode for orange and white emission

Jin, Yadong; Yang, Jiping; Heremans, Paul; Van der Auweraer, M.; Geise, H. J.; Borghs, Gustaaf (1999)

Advances in organic blue and green light sources: comparison with gaN- and ZnSe-based devices

Jain, Suresh; Geens, Wim; Poortmans, Jef; Heremans, Paul; Nijs, Johan; Mertens, Robert; Willander, M. (1999)

Electrical properties and reliability of ultrathin remote plasma enhanced CVD Si3N4 layers

Houssa, Michel; Degraeve, Robin; Pomarede, C.; van Dijk, Kitty; Werkhoven, Chris; Mertens, Paul; Heyns, Marc; Stesmans, Andre (1999)

Effect of oxide and W-CMP on the material properties and electromigration behaviour of layered aluminium metallizations

Heyvaert, Ilse; Van Hove, Marleen; Witvrouw, Ann; Maex, Karen; Saerens, Annelies; Roussel, Philippe; Bender, Hugo (1999)

Technology and reliability aspects of ultra-thin silicon dioxide layers

Heyns, Marc; Nigam, Tanya; Degraeve, Robin; Mertens, Paul; Schaekers, Marc; Bearda, Twan; De Gendt, Stefan; Groeseneken, Guido; Maes, Herman; Claes, Martine; Houssa, Michel; Vandewalle, N.; Ausloos, M. (1999)

Record-efficiency light-emitting diodes

Heremans, Paul; Windisch, Reiner; Kuijk, Maarten; Dutta, Barundeb; Borghs, Gustaaf (1999)

Nanostructured light-emitting diodes

Heremans, Paul (1999)

Broadband wireless OFDM communication

Haspeslagh, Johan (1999)

A 256-point complex FFT/IFFT for a 100Mbit/s orthogonal frequency division multiplex modem

Gyselinckx, Bert; Eberle, Wolfgang; Engels, Marc; Vergara, Mario (1999)

Impact of temperature and breakdown statistics on reliability predictions for ultra-thin oxides

Groeseneken, Guido; Degraeve, Robin; Kaczer, Ben (1999)

The mechanisms of hot carrier degradation and oxide breakdown in submicron CMOS techmologies

Groeseneken, Guido (1999)

Modelling the influence of pad bending on the planarization performance during CMP

Grillaert, Joost; Meuris, Marc; Vrancken, Evi; Devriendt, Katia; Fyen, Wim; Heyns, Marc (1999)

Presentations: Recent submissions

Report of AHG on video decoder quality of service ﻿

Implementation October 1999 meeting report - chairman report ﻿

Induced magnetoresistance in semiconducting devices due to single sub-micron magnetic barriers and random magnetic fields ﻿

A self-calibrating logarithmic image sensor ﻿

Chemical role of SF6 in a SiCl4-based reactive ion etching of GaN ﻿

Ideal chemistry for reactive ion etching of GaN ﻿

Ideal chemistry for reactive ion etching of GaN ﻿

Investigation of properties of SiO2 defects created during electric stressing at different temperatures ﻿

Host guest system in small molecule-doped polymer light-emitting diode for orange and white emission ﻿

Advances in organic blue and green light sources: comparison with gaN- and ZnSe-based devices ﻿

Electrical properties and reliability of ultrathin remote plasma enhanced CVD Si3N4 layers ﻿

Effect of oxide and W-CMP on the material properties and electromigration behaviour of layered aluminium metallizations ﻿

Technology and reliability aspects of ultra-thin silicon dioxide layers ﻿

Record-efficiency light-emitting diodes ﻿

Nanostructured light-emitting diodes ﻿

Broadband wireless OFDM communication ﻿

A 256-point complex FFT/IFFT for a 100Mbit/s orthogonal frequency division multiplex modem ﻿

Impact of temperature and breakdown statistics on reliability predictions for ultra-thin oxides ﻿

The mechanisms of hot carrier degradation and oxide breakdown in submicron CMOS techmologies ﻿

Modelling the influence of pad bending on the planarization performance during CMP ﻿

Report of AHG on video decoder quality of service

Implementation October 1999 meeting report - chairman report

Induced magnetoresistance in semiconducting devices due to single sub-micron magnetic barriers and random magnetic fields

A self-calibrating logarithmic image sensor

Chemical role of SF6 in a SiCl4-based reactive ion etching of GaN

Ideal chemistry for reactive ion etching of GaN

Ideal chemistry for reactive ion etching of GaN

Investigation of properties of SiO2 defects created during electric stressing at different temperatures

Host guest system in small molecule-doped polymer light-emitting diode for orange and white emission

Advances in organic blue and green light sources: comparison with gaN- and ZnSe-based devices

Electrical properties and reliability of ultrathin remote plasma enhanced CVD Si3N4 layers

Effect of oxide and W-CMP on the material properties and electromigration behaviour of layered aluminium metallizations

Technology and reliability aspects of ultra-thin silicon dioxide layers

Record-efficiency light-emitting diodes

Nanostructured light-emitting diodes

Broadband wireless OFDM communication

A 256-point complex FFT/IFFT for a 100Mbit/s orthogonal frequency division multiplex modem

Impact of temperature and breakdown statistics on reliability predictions for ultra-thin oxides

The mechanisms of hot carrier degradation and oxide breakdown in submicron CMOS techmologies

Modelling the influence of pad bending on the planarization performance during CMP