Recently added

Besling, Wim; Young, Edward; Conard, Thierry; Zhao, Chao; Vandervorst, Wilfried; Caymax, Matty; De Gendt, Stefan; Heyns, Marc; Maes, Jos; Tuominen, Marko; Haukka, S. (2001)

Focused ion beam analysis of Cu/low-k metallisation structures

Bender, Hugo (2001)

Chemical analysis on Focused Ion Beam cross-sections by scanning Auger microscopy

Bender, Hugo (2001)

Thin-film polysilicon solar cells on foreign substrates using direct thermal CVD: material and solar cell design

Beaucarne, Guy; Poortmans, Jef; Slaoui, A. (2001)

Guided wave photonic ICs: photonic crystals versus total internal reflection

Baets, Roel; Bienstman, Peter; Bogaerts, Wim; Taillaert, Dirk (2001)

Towards convergence of optical interconnect and optical communication technologies

Baets, Roel (2001)

MEMS in a Si IC environment

Baert, Kris; Campitelli, Andrew; Borzi, Raffaella (2001)

Presentations: Recent submissions

Study on MPEG-21 (digital audiovisual framework) Part 1 v2.0 ﻿

MPEG-21 overview ﻿

Report of AHG on MPEG-21 PDTR study ﻿

MPEG-21 in an ambient intelligence context ﻿

Expression of interest in MPEG-4 part 9: Reference hardware description ﻿

Magnetic nanoparticles in a semiconductor ﻿

SOI photonic crystal fabrication using deep UV lithography ﻿

Design and optimization of dynamically reconfigurable embedded systems ﻿

Crystalline silicon thin films with porous Si backside reflector ﻿

The use of electroplating and electroless plating in the field of micro-electronic packaging and high density interconnections ﻿

Multilayer thin film technology with integrated passive components: enabling technology for microwave "systems-in-a-package" integration ﻿

Assembly using flip chip instead of wire-bonding ﻿

Assembly of advanced integrated circuits: flip chip interconnections, thin film I/O redistribution and chip sized packages ﻿

Characterization of ALCVD Al2O3-ZrO2 nanolaminates, link between electrical and structural properties ﻿

Focused ion beam analysis of Cu/low-k metallisation structures ﻿

Chemical analysis on Focused Ion Beam cross-sections by scanning Auger microscopy ﻿

Thin-film polysilicon solar cells on foreign substrates using direct thermal CVD: material and solar cell design ﻿

Guided wave photonic ICs: photonic crystals versus total internal reflection ﻿

Towards convergence of optical interconnect and optical communication technologies ﻿

MEMS in a Si IC environment ﻿

Study on MPEG-21 (digital audiovisual framework) Part 1 v2.0

MPEG-21 overview

Report of AHG on MPEG-21 PDTR study

MPEG-21 in an ambient intelligence context

Expression of interest in MPEG-4 part 9: Reference hardware description

Magnetic nanoparticles in a semiconductor

SOI photonic crystal fabrication using deep UV lithography

Design and optimization of dynamically reconfigurable embedded systems

Crystalline silicon thin films with porous Si backside reflector

The use of electroplating and electroless plating in the field of micro-electronic packaging and high density interconnections

Multilayer thin film technology with integrated passive components: enabling technology for microwave "systems-in-a-package" integration

Assembly using flip chip instead of wire-bonding

Assembly of advanced integrated circuits: flip chip interconnections, thin film I/O redistribution and chip sized packages