Recently added

Evaluation of cleaning recipes based on ozonated water for pre-gate oxide cleaning

Jeon, J. S.; Ogle, B.; Baeyens, Martien; Mertens, Paul (1998)

Demo for CGD parameter estimation in 3D rendering

Huybrechts, Tom; Scherpenberg, Andy; Lafruit, Gauthier (1998)

Effect of Si surface roughness on the current-voltage characteristics of ultra-thin gate oxides

Houssa, Michel; Nigam, Tanya; Mertens, Paul; Heyns, Marc (1998)

Advanced cleaning and ultra-thin oxide technology

Heyns, Marc; Cornelissen, Ingrid; De Gendt, Stefan; Degraeve, Robin; Knotter, D. M.; Mertens, Paul; Mertens, S.; Meuris, Marc; Nigam, Tanya; Rotondaro, Antonio; Schaekers, Marc; Teerlinck, Ivo; Vos, Rita; Wolke, K. (1998)

VCSEL and high performance MCLED interconnects

Heremans, Paul (1998)

Tip-on-tip: a novel AFM tip configuration for the electrical characterization of semiconductor devices

Hantschel, Thomas; Trenkler, Thomas; Vandervorst, Wilfried; Malave, A.; Kulisch, W.; Oesterschulze, E.; Buechel, D. (1998)

Chemistry of the silicon oxide surface: adsorption from SC1 solutions

Hall, L.; Sees, J.; Hurd, Trace; Schmidt, B.; Bellay, L.; Loewenstein, Lee; Mertens, Paul (1998)

Radiation effects on metal contaminated Si diodes

Hakata, T.; Ohyama, Hidenori; Simoen, Eddy; Claeys, C.; Sunage, H.; Miyahara, K. (1998)

A flexible architecture for future wireless local area networks

Gyselinckx, Bert; Eberle, Wolfgang; Engels, Marc; Schurgers, Curt; Thoen, Steven; Vandenameele, Patrick; Van der Perre, Liesbet (1998)

Modelling step height reduction based on pad-substrate interactions for different pads

Grillaert, Joost; Meuris, Marc; Heylen, Nancy; Devriendt, Katia; Vrancken, Evi; Heyns, Marc (1998)

193 nm lithography options: single layer, bilayer and TSI

Goethals, Mieke (1998)

Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process

Gao, Teng; Coenegrachts, Bart; Waeterloos, Joost; Beyer, Gerald; Meynen, Herman; Van Hove, Marleen; Maex, Karen (1998)

Ferroelectric properties and reliability issues of PLZT thin films

Fè, Laura; Wouters, Dirk; Norga, Gerd; Maes, Herman (1998)

Dopant effects in sol-gel based PZT based ferroelectric memories: lanthanum vs tantalum

Fè, Laura; Wouters, D. J.; Norga, Gerd; Bartic, T. A.; Maes, Herman (1998)

Optimization of an advanced positive DUV resist for 248 nm L/S pattern printing

Ercken, Monique; Pollers, Ingrid; Van Puyenbroeck, Ilse; Goethals, Mieke; Ronse, Kurt; Pawlowski, G.; Spiess, Walter (1998)

Hydrogen passivation of newly developed EMC multicrystalline silicon

Einhaus, Roland; Duerinckx, Filip; Van Kerschaver, Emmanuel; Szlufcik, Jozef; Durand, F.; Ribeyrin, P. J.; Duby, J. C.; Sarti, D.; Goaer, G.; Le, G. N.; Martinuzzi, S.; Perichaud, I.; Clerc, L. (1998)

Formation of continuous and ultra-thin PtSi layers for infrared detector applications

Donaton, R. A.; Jin, S.; Bender, Hugo; Maex, Karen; Vantomme, Andre; Langouche, G. (1998)

Relation between oxide-CMP induced defects and post-CMP cleaning strategies

Devriendt, Katia; Vrancken, Evi; Heylen, Nancy; Grillaert, Joost; Meuris, Marc; Heyns, Marc; Ling, Zhi Ming (1998)

Effect of CMP slurry filtration on wafer defectivity

Devriendt, Katia; Meuris, Marc; Heylen, Nancy; Vrancken, Evi; Grillaert, Joost; Heyns, Marc; Ling, Zhi Ming (1998)

Exploiting WDM to develop innovative protection strategies and improve survivability

Demeester, Piet (1998)

Presentations: Recent submissions

Evaluation of cleaning recipes based on ozonated water for pre-gate oxide cleaning ﻿

Demo for CGD parameter estimation in 3D rendering ﻿

Effect of Si surface roughness on the current-voltage characteristics of ultra-thin gate oxides ﻿

Advanced cleaning and ultra-thin oxide technology ﻿

VCSEL and high performance MCLED interconnects ﻿

Tip-on-tip: a novel AFM tip configuration for the electrical characterization of semiconductor devices ﻿

Chemistry of the silicon oxide surface: adsorption from SC1 solutions ﻿

Radiation effects on metal contaminated Si diodes ﻿

A flexible architecture for future wireless local area networks ﻿

Modelling step height reduction based on pad-substrate interactions for different pads ﻿

193 nm lithography options: single layer, bilayer and TSI ﻿

Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process ﻿

Ferroelectric properties and reliability issues of PLZT thin films ﻿

Dopant effects in sol-gel based PZT based ferroelectric memories: lanthanum vs tantalum ﻿

Optimization of an advanced positive DUV resist for 248 nm L/S pattern printing ﻿

Hydrogen passivation of newly developed EMC multicrystalline silicon ﻿

Formation of continuous and ultra-thin PtSi layers for infrared detector applications ﻿

Relation between oxide-CMP induced defects and post-CMP cleaning strategies ﻿

Effect of CMP slurry filtration on wafer defectivity ﻿

Exploiting WDM to develop innovative protection strategies and improve survivability ﻿