Recently added

Advanced capabilities and applications of a sputter-RBS system

Brijs, Bert; Deleu, Jeroen; Beyer, Gerald; Vandervorst, Wilfried (1998)

Post metal etch polymer removal: an investigation of the cleaning to remove residual of Si-C and Si-F after fluorocarbon plama etch on the silicon surface

Boullart, Werner; Mannaert, Geert; Graham, S.; Tarassenko, C.; Mouche, Laurent (1998)

Temperature stability of patterned ferromagnetic tunneling junctions

Boeve, Hans; De Boeck, Jo; van de Veerdonk, R.; Moodera, J. S.; Borghs, Gustaaf (1998)

IMP liners for all speed fill

Beyer, Gerald; Maex, Karen; Daniels, Stephen; Maity, Nirmalya; Bassanini, Davide (1998)

0.5µm and 0.35µm BiCMOS - silicon etch developement at IMEC

Beckx, Stephan (1998)

Properties of p-n-diodes made in polysilicon layers with intermediate grain size

Beaucarne, Guy; Poortmans, Jef; Caymax, Matty; Nijs, Johan; Mertens, Robert (1998)

Behaviour of metallic contaminants during MOS processing

Bearda, Twan; De Gendt, Stefan; Loewenstein, Lee; Knotter, Martin; Mertens, Paul; Heyns, Marc (1998)

Single step alkaline cleaning solution for advanced semiconductor cleaning

Baeyens, Martien; Hub, W.; Kolbesen, B. O.; Martin, A.R.; Mertens, Paul (1998)

Basics of electromagnetics

Baets, Roel (1998)

Micro-cavity light emitting diodes

Baets, Roel (1998)

Ultra-sensitive spin-valve structures grown on n-GaAs by single bath electrodeposition

Attenborough, Karen; Boeve, Hans; De Boeck, Jo; Borghs, Gustaaf; Celis, Jean-Pierre (1998)

Electroless nickel-gold stud bumping on laminate for flip-chip assembly

Zang, S.; Vereecken, M.; De Baets, J.; Van Calster, Andre; Vervaet, A.; Peeters, Joris; Allaert, K. (1997)

Scaling of sol-gel PZT ferroelectric capacitors for low-voltage operation

Wouters, Dirk; Norga, Gerd; Beckers, Françoise; Bogaerts, Lieve; Maes, Herman (1997)

New sensitive electrical measurement techniques for the study of stress induced voiding

Witvrouw, Ann; Drijbooms, Chris; Bender, Hugo; Maex, Karen (1997)

Monte Carlo simulation of the formation of M2-+ molecular ions sputtered from metallic materials

Vlekken, J.; Wu, Ting-Di; D'Olieslaeger, Marc; Knuyt, G.; Vandervorst, Wilfried; De Schepper, Patrick (1997)

Investigation of the correlation between parameters defining the state of sputtered particles

Vlekken, J.; Croes, Kris; D'Olieslaeger, Marc; Knuyt, G.; Vandervorst, Wilfried; De Schepper, Patrick (1997)

Cable modems: tales and technology

Vernalde, Serge (1997)

Microstructure of YBa2Cu3O7-delta Josephson junction in relation to their properties

Verbist, K.; Lebedev, O. I.; Verhoeve, M. A. J.; Winchern, R.; Rijnders, A. J. H. M.; Blank, D. H. A.; Tafuri, F.; Bender, Hugo; Van Tendeloo, G. (1997)

Backscattering/channeling study of high dose rare-earth implants in Si

Vantomme, Andre; Wu, Ming Fang; Wahl, U.; Pattyn, Hugo; Bender, Hugo; Langouche, G. (1997)

The etching behavior of tungsten (w) with respect to the orientation of the grain boudnary and masking layers

Vanhaelemeersch, Serge; Van den hove, Luc; Lee, Hean-Cheal (1997)

Presentations: Recent submissions

Advanced capabilities and applications of a sputter-RBS system ﻿

Post metal etch polymer removal: an investigation of the cleaning to remove residual of Si-C and Si-F after fluorocarbon plama etch on the silicon surface ﻿

Temperature stability of patterned ferromagnetic tunneling junctions ﻿

IMP liners for all speed fill ﻿

0.5µm and 0.35µm BiCMOS - silicon etch developement at IMEC ﻿

Properties of p-n-diodes made in polysilicon layers with intermediate grain size ﻿

Behaviour of metallic contaminants during MOS processing ﻿

Single step alkaline cleaning solution for advanced semiconductor cleaning ﻿

Basics of electromagnetics ﻿

Micro-cavity light emitting diodes ﻿

Ultra-sensitive spin-valve structures grown on n-GaAs by single bath electrodeposition ﻿

Electroless nickel-gold stud bumping on laminate for flip-chip assembly ﻿

Scaling of sol-gel PZT ferroelectric capacitors for low-voltage operation ﻿

New sensitive electrical measurement techniques for the study of stress induced voiding ﻿

Monte Carlo simulation of the formation of M2-+ molecular ions sputtered from metallic materials ﻿

Investigation of the correlation between parameters defining the state of sputtered particles ﻿

Cable modems: tales and technology ﻿

Microstructure of YBa2Cu3O7-delta Josephson junction in relation to their properties ﻿

Backscattering/channeling study of high dose rare-earth implants in Si ﻿

The etching behavior of tungsten (w) with respect to the orientation of the grain boudnary and masking layers ﻿